Synopsys Totem 2026 is the industry’s gold-standard voltage drop (IR) and electromigration (EM) sign-off solution for transistor-level and mixed-signal designs, trusted for thousands of tapeouts and certified by major foundries for nodes down to 1.6nm . The 2026 release enhances its capabilities through the Totem-SC variant, delivering significant performance breakthroughs for analog/mixed-signal (AMS) design signoff.
Key New Features in the 2026 Release
Elastic Distributed Computing (Totem-SC)
The major highlight is the introduction of elastic distributed computing in Totem-SC . This enables AMS signoff tasks to achieve up to a 10x speedup by automatically distributing large-scale signoff tasks across multiple compute nodes . The key innovations behind this performance leap include:
- Intelligent Task Splitting: Automatically divides tasks based on circuit structure to optimize parallel granularity and reduce communication overhead
- Distributed Memory Management: Optimizes cross-node data sharing to avoid redundant computation
- Fault Tolerance & Elastic Scaling: Supports dynamic addition or removal of nodes, ensuring high reliability for long-running signoff tasks
Cloud-Native & High-Capacity Analysis
Totem-SC leverages the SeaScape big-data elastic compute infrastructure , enabling:
- Near-instant start and near-linear scalability across thousands of CPU cores
- Analysis of very large chips, including full HBM memories and CMOS image sensors (CIS)
- Low per-core memory requirements, suitable for cloud-based execution
TSMC A14 & N2 Node Support
The 2026 release extends support for advanced process nodes :
- TSMC A14: Collaborates with RedHawk-SC for digital power integrity and PathFinder-SC for ESD signoff at A14
- TSMC N2: Provides analog power integrity signoff at ultra-high capacity for large N2-based designs and embedded memories
